3D Integration in Advanced CMOS and Sensors
As traditional computing technologies continue to scale, cost and process complexity has driven the industry to look for new sources of performance gains. 3D integration has shown to be a disruptive technology that has demonstrated dramatic improvements in system speed, power consumption, and noise reduction. By reducing parasitic losses and improving connectivity, 3D technologies can be used in conjunction with the most advanced 2D technologies and offer a means to harness the full system performance potential. This presentation will review current industry advances, as well as a glimpse into the next generation of 3D.
6:00pm Doors open, networking
Brian Mattis is the Director of Integration Engineering at Novati Technologies, leading the development and integration of emerging technologies. He provides technology development and product commercialization solutions for companies exploring 2.5D/3D integration, MEMS, BioMEMs, and semiconductor technologies. Prior to Novati, he held device engineering positions at Samsung and Intel, where he helped build the integration for the 45nm, 32nm, and 16nm nodes. Brian has extensive experience in device integration, semiconductor physics, technology pathfinding, and risk analysis.
Brian is a founding officer of the Central Texas MEMS & Sensors IEEE Chapter and holds Ph.D., M.S., and B.S. degrees from the University of California, Berkeley in Electrical Engineering, with a minor in Material Science.